THERMOMECHANICAL BEHAVIOR OF STRESS-REDUCED SILICON-WAFERS

被引：4

|

作者：

KIRSCHT, FG

TANZER, D

HANSCH, C

机构：

来源：

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1982年 / 74卷 / 01期

关键词：

D O I：

10.1002/pssa.2210740144

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：K1 / &

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