MIGRATION OF LIQUID-FILM AND GRAIN-BOUNDARY IN MO-NI ALLOY INDUCED BY TUNGSTEN ADDITION

被引：0
|
作者：
KANG, HK
HACKNEY, S
机构：
[1] KOREA ADV INST SCI & TECHNOL,DEPT MAT SCI & TECHNOL,SEOUL 131,SOUTH KOREA
[2] NBS,DIV MET,GAITHERSBURG,MD 20899
来源：
JOURNAL OF METALS | 1985年 / 37卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：A56 / A56
页数：1
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