FINE-LINE PROCESS YIELDS HIGH-DENSITY PRINTED-CIRCUIT BOARDS

被引：0

作者：

CHIN, S

机构：

来源：

ELECTRONIC PRODUCTS MAGAZINE | 1984年 / 27卷 / 11期

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D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：20 / 21

页数：2

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[1] LASER DRILLING OF HIGH-DENSITY PRINTED-CIRCUIT BOARDS
KLAUSER, HE
[J]. IEEE JOURNAL OF QUANTUM ELECTRONICS, 1981, 17 (12) : 160 - 160
[2] AN ADVANCED ROUTING SYSTEM FOR HIGH-DENSITY LARGE PRINTED-CIRCUIT BOARDS
ICHIHARA, N
HISATOMI, Y
HOSHIAI, F
[J]. NEC RESEARCH & DEVELOPMENT, 1987, (84): : 30 - 38
[3] COMPUTER-CONTROLLED OPTICAL-TESTING OF HIGH-DENSITY PRINTED-CIRCUIT BOARDS
WEST, MA
DEFOSTER, SM
BALDWIN, EC
ZIEGLER, RA
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1983, 27 (01) : 50 - 58
[4] PHOTOCHEMICAL IMAGE-FORMATION PROCESS FOR HIGH-DENSITY PRINTED-CIRCUIT PATTERNS
TAKAHASHI, K
IKARI, K
KANO, J
TAKAMURA, T
UEKI, T
YAMAOKA, T
TSUNODA, T
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1981, 8 (1-2): : 99 - 102
[5] PROCESS CONSIDERATIONS IN THE FABRICATION OF FLUOROPOLYMER PRINTED-CIRCUIT BOARDS
LIGHT, DN
WILCOX, JR
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (01): : 118 - 126
[6] DESIGNING PRINTED-CIRCUIT BOARDS
MCGRATH, RA
[J]. COMPUTER GRAPHICS WORLD, 1985, 8 (09) : 69 - &
[7] POLYETHERIMIDE FOR PRINTED-CIRCUIT BOARDS
GOING, TJ
[J]. INDUSTRIAL FINISHING, 1983, 59 (03): : 35 - 35
[8] HIGH-DENSITY AND LOW-COST WITH PRINTED-CIRCUIT HYBRID TECHNOLOGY
FLEMING, JH
LOW, RN
[J]. HEWLETT-PACKARD JOURNAL, 1980, 31 (03): : 25 - 26
[9] ELECTRIC TEST UNITS FOR PRINTED-CIRCUIT BOARDS IN THE PRODUCTION PROCESS
SCHEDONE, W
SCHEFRANEK, HJ
FRANK, M
[J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1986, 94 (04): : 234 - 236
[10] Additive process for fabricating high density printed circuit boards
King, David R.
[J]. International SAMPE Electronics Conference, 1992, 6 : 630 - 640

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