REACTIVE ION ETCHING OF COPPER-FILMS IN SICL4 AND N2 MIXTURE

被引：32
|
作者：
OHNO, K
SATO, M
ARITA, Y
机构：
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 1989年 / 28卷 / 06期
关键词：
D O I：
10.1143/JJAP.28.L1070
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：L1070 / L1072
页数：3
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