BARRIER BEHAVIOR OF TIW BETWEEN COPPER AND ALUMINUM

被引：6
|
作者：
KRAUTZ, H
WENZEL, C
BORNKESSEL, K
BLASEK, G
机构：
来源：
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1988年 / 110卷 / 02期
关键词：
D O I：
10.1002/pssa.2211100246
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：K77 / K79
页数：3
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