FULL-WAVE CHARACTERIZATION OF A THROUGH HOLE VIA USING THE MATRIX-PENCILLED MOMENT METHOD

被引:0
|
作者
HSU, SG
WU, RB
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A full wave analysis was presented in this paper for the propagation characteristics of a via which connects two semi-infinitely long transmission lines through a hole in a ground plane. The current distribution on the via and a section of transmission line became solved under the thin wire approximation by the moment method and the scattering parameters are extracted by the matrix pencil method. Numerical results were included to investigate the frequency dependent propagation characteristics for via structures with various geometrical parameters, e.g. the via height, wire diameter, and via hole radius. The radiation loss was shown from a comparison with the quasi-static model to become important if the via height is larger than one tenth of a wavelength. The radiation mechanism could be mainly attributed towards the associated wire antenna structure and, at rather high frequencies, towards the associated grounded via structure.
引用
收藏
页码:1540 / 1547
页数:8
相关论文
共 50 条
  • [1] FULL-WAVE CHARACTERIZATION OF A THROUGH HOLE VIA IN MULTILAYERED PACKAGING
    HSU, SG
    WU, RB
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (05) : 1073 - 1081
  • [2] Full-wave solver for microstrip trace and through-hole via in layered media
    Ong, Chong-Jin
    Wu, Boping
    Tsang, Leung
    Gu, Xiaoxiong
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (02): : 292 - 302
  • [3] FULL-WAVE ANALYSIS OF PROPAGATION CHARACTERISTICS OF A THROUGH HOLE USING THE FINITE-DIFFERENCE TIME-DOMAIN METHOD
    MAEDA, S
    KASHIWA, T
    FUKAI, I
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1991, 39 (12) : 2154 - 2159
  • [4] Material Characterization Through a Full-Wave Approach Based on the BI-RME Method
    Battistutta, Simone
    Bressan, Marco
    Bozzi, Maurizio
    Perregrini, Luca
    [J]. 2017 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2017,
  • [5] Hybrid of Moment Method and Mode Matching Technique for Full-Wave Analysis of SIW Circuits
    Rezaiesarlak, R.
    Salehi, M.
    Mehrshahi, E.
    [J]. APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY JOURNAL, 2011, 26 (08): : 688 - 695
  • [6] Derivation of the Full-Wave Equivalent Model of Via Hole in a Two-Layered Substrate
    Shen, Zhongxiang
    Zhang, Qi
    [J]. 2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
  • [7] Multifrequency Full-Wave Simulations of Vegetation Using a Hybrid Method
    Gu, Weihui
    Tsang, Leung
    Colliander, Andreas
    Yueh, Simon H.
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2022, 70 (01) : 275 - 285
  • [8] Full-wave Electromagnetic and Quasi-static Analysis of Through Silicon Via
    Li, Ying
    Jandhyala, Vikram
    [J]. 2010 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, 2010,
  • [9] A hybrid full-wave analysis of via hole grounds using finite difference and finite element time domain methods
    Koh, D
    Lee, H
    Itoh, T
    [J]. 1997 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS I-III: HIGH FREQUENCIES IN HIGH PLACES, 1997, : 89 - 92
  • [10] Generalized Admittance Matrix Method for Fast Full-Wave Analysis of Integrated Lens Antennas
    Jorgensen, Erik
    Meincke, Peter
    Neto, Andrea
    Llombart, Nuria
    [J]. 2014 8TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP), 2014, : 3195 - 3199