AC/DC CHARACTERIZATION OF NMOS AND PMOS HOT-CARRIER-INDUCED DEGRADATION UNDER AC/DC STRESS

被引:3
|
作者
DAWES, M
ALAVI, M
KIM, DM
机构
[1] TEKTRONIX INC,BEAVERTON,OR 97077
[2] OREGON GRAD CTR,BEAVERTON,OR 97006
关键词
D O I
10.1109/16.62305
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ac/dc measurement of NMOS and PMOS/Ja, shifts are compared following dc stress. The results of the/Jsal shifts are found to be the same. The ac/rfsat measurements were performed under a variety of different conditions (varying frequency, amplitude, and base level) and showed that hot-carrier-induced interfaced states are shallow and fast (<20 ns). AC versus dc stressing is also examined. In PMOS devices, pulsed drain stress is found to be generally quasi-static, while pulsed gate stress produced enhanced device degradation under certain bias conditions. In NMOS transistors ac drain stress was found to be quasi-static in strong device saturation, while ac gate stress resulted in significantly enhanced degradation. In weak device saturation, both gate and drain pulsing resulted in early catastrophic device failure. © 1990 IEEE
引用
收藏
页码:2416 / 2419
页数:4
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