Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave

被引:0
|
作者
Park, Ik Keun [1 ]
Park, Tae Sung [2 ]
机构
[1] Seoul Natl Univ Sci & Technol, Dept Mech & Automot Engn, Seoul, South Korea
[2] Hanyang Univ, Dept Mech Engn, Seoul, South Korea
基金
新加坡国家研究基金会;
关键词
component; scanning acoustic microscope; V(z) curve; dipersion; surface wave velocity; thin film thickness;
D O I
10.21307/ijssis-2019-049
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, we suggest a method to measure the thickness of thin films nondestructively using the dispersion characteristics of a surface acoustic wave propagating along the thin film surface. To measure the thickness of thin films, we deposited thin films with different thicknesses with range of 200 similar to 1000 nm on a Si(100) wafer by controlling the deposition time by DC sputtering technique. The thickness of the thin films was measured using a scanning electron microscope. Subsequently, the surface wave velocity of the thin films with different thickness was measured using V(z) curve method of scanning acoustic microscopy. The correlation between the measured thickness and surface acoustic wave velocity was verified. The wave velocity of the film decreased as the film thickness increased. Consequently, film thickness can be determined by measuring the dispersion characteristics of the surface acoustic wave velocity.
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页数:4
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