共 50 条
- [1] BERYLLIUM COPPER IN HIGH-RELIABILITY WIRE APPLICATIONS [J]. WIRE JOURNAL INTERNATIONAL, 1983, 16 (09): : 49 - 49
- [2] High-reliability bonding wire for automotive IC's [J]. Nippon Steel Tech. Rep, 2006, 93 (26-27):
- [3] NONDESTRUCTIVE BOND PULL IN HIGH-RELIABILITY APPLICATIONS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1978, 1 (03): : 228 - 236
- [4] HIGH-RELIABILITY THERMOCOMPRESSION BONDING FOR HYBRID APPLICATIONS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1978, 1 (03): : 223 - 227
- [5] SUPERCONDUCTIVE WIRE BONDING WITH HIGH-RELIABILITY AT 4.2-K [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1989, 28 (12): : 2479 - 2484
- [6] High-reliability copper interconnects for future LSI's [J]. REPORT OF RESEARCH CENTER OF ION BEAM TECHNOLOGY HOSEI UNIVERSITY, SUPPLEMENT NO 14, MARCH 1996, 1996, : 67 - 72
- [7] THICK-FILM CIRCUITS FOR HIGH-RELIABILITY APPLICATIONS [J]. ELECTRONICS AND POWER, 1980, 26 (09): : 709 - 711
- [8] Modeling for assessing Semiconductor Packages in High-Reliability Applications [J]. 2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,
- [9] Optical submount development for high-reliability/performance applications [J]. OPTOELECTRONIC INTERCONNECTS AND PACKAGING IV, 1997, 3005 : 50 - 53
- [10] High-reliability copper interconnects through dry etching process [J]. Igarashi, Yasushi, 1600, JJAP, Minato-ku, Japan (34):