共 50 条
- [1] Evaluation of the Effects of Au Content on Intermetallic Compound Layer Growth in Pb-Sn and Sn-Ag-Cu Solder Joints BRAZING AND SOLDERING, PROCEEDINGS, 2006, : 26 - 31
- [3] Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization Journal of Electronic Materials, 2000, 29 : 1170 - 1174
- [4] Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints EMAP 2005: International Symposium on Electronics Materials and Packaging, 2005, : 88 - 94
- [7] The effects of Au film thickness on the reliability of Sn-Pb solder joints 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [8] Failure analysis of In/Au solder joints ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 817 - +
- [9] Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints Journal of Materials Science: Materials in Electronics, 2014, 25 : 4219 - 4224