MORPHOLOGY OF THICK-FILM RESISTOR-CONDUCTOR INTERFACE

被引：0

|

作者：

TANDAN, D ^{[1
]}

VEST, RW ^{[1
]}

机构：

[1] PURDUE UNIV,W LAFAYETTE,IN 47907

来源：

AMERICAN CERAMIC SOCIETY BULLETIN | 1977年 / 56卷 / 03期

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D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

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页码：326 / 326

页数：1

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