CROSSTALK AND TRANSIENT ANALYSES OF HIGH-SPEED INTERCONNECTS AND PACKAGES

被引:21
|
作者
YOU, H [1 ]
SOMA, M [1 ]
机构
[1] UNIV WASHINGTON,DEPT ELECT ENGN,SEATTLE,WA 98195
关键词
D O I
10.1109/4.75011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a new method for the crosstalk and transient analyses of lossy interconnects with arbitrary termination circuits. In order to analyze an interconnect containing N signal conductors, we first derive closed-form formulas to determine its transfer functions, and then apply the inverse Fourier transform to obtain its time-domain pulse response functions. Two types of equivalent circuit models can be formulated once the pulse response functions of the interconnect are found. The circuit schematics of the models depend on the number of the signal conductors, irrespective of the physical parameters of the interconnect. These models are compatible with standard circuit simulation tools since they consist of linear resistive networks and linear-dependent sources only. Two example circuits are studied to examine the accuracy and efficiency of the present method.
引用
收藏
页码:319 / 329
页数:11
相关论文
共 50 条
  • [1] Crosstalk analysis between interconnects in high-speed server packages
    Choi, Jinwoo
    Krauter, Byron
    Haridass, Anand
    Weekly, Roger
    Douriet, Daniel
    Chun, Sungjun
    [J]. 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 333 - +
  • [2] Transient Analysis Of Crosstalk Coupling Between High-Speed Carbon Nanotube Interconnects
    D'Amore, M.
    Sarto, M. S.
    Tamburrano, A.
    [J]. 2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, 2008, : 81 - 86
  • [3] MINIMIZATION OF DELAY AND CROSSTALK IN HIGH-SPEED VLSI INTERCONNECTS
    ZHANG, QJ
    LUM, S
    NAKHLA, MS
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1992, 40 (07) : 1555 - 1563
  • [4] Signal integrity optimization of high-speed VLSI packages and interconnects
    Zhang, QJ
    Wang, F
    Nakhla, MS
    Bandler, JW
    Biernacki, RM
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1073 - 1076
  • [5] Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review
    Park, Junyong
    Kim, Donghyun
    [J]. IEEE ACCESS, 2024, 12 : 22880 - 22891
  • [6] Pulse crosstalk analysis of bondwires in high-speed plastic packages
    Yun, SK
    Lee, HY
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (12A): : 6831 - 6835
  • [7] Crosstalk bounded uncorrelated jitter (BUJ) for high-speed interconnects
    Kuo, A
    Rosales, R
    Farahmand, T
    Tabatabaei, S
    Ivanov, A
    [J]. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2005, 54 (05) : 1800 - 1810
  • [8] Spectral Models for the Estimation of Delay and Crosstalk in High-Speed Interconnects
    Antonini, Giulio
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2010, 52 (03) : 728 - 736
  • [9] Crosstalk timing model for high-speed interconnects with impedance discontinuity
    Kuo, Andy
    Labun, Andrew
    Swart, Nicholas
    Ivanov, Andre
    [J]. 2007 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2007, : 194 - +
  • [10] Crosstalk characterization of high-speed interconnects in time-domain
    Kuo, CC
    Lin, YH
    Wu, TL
    [J]. 2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2, 2001, : 657 - 660