共 50 条
- [1] Crosstalk analysis between interconnects in high-speed server packages [J]. 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 333 - +
- [2] Transient Analysis Of Crosstalk Coupling Between High-Speed Carbon Nanotube Interconnects [J]. 2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, 2008, : 81 - 86
- [4] Signal integrity optimization of high-speed VLSI packages and interconnects [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1073 - 1076
- [5] Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review [J]. IEEE ACCESS, 2024, 12 : 22880 - 22891
- [6] Pulse crosstalk analysis of bondwires in high-speed plastic packages [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (12A): : 6831 - 6835
- [9] Crosstalk timing model for high-speed interconnects with impedance discontinuity [J]. 2007 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2007, : 194 - +
- [10] Crosstalk characterization of high-speed interconnects in time-domain [J]. 2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2, 2001, : 657 - 660