RESIDUAL-STRESSES AND CRACKING IN METAL CERAMIC SYSTEMS FOR MICROELECTRONICS PACKAGING

被引：75

|

作者：

HSUEH, CH

EVANS, AG

机构：

来源：

JOURNAL OF THE AMERICAN CERAMIC SOCIETY | 1985年 / 68卷 / 03期

关键词：

D O I：

10.1111/j.1151-2916.1985.tb09648.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

收藏

页码：120 / 127

页数：8

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