EFFECT OF MOLECULAR-STRUCTURE OF PHENOLIC RESIN ON SOLDER DIP RESISTANCE AND PEEL STRENGTH OF PRINTED CIRCUIT ADHESIVES

被引：0

作者：

NAMIKI, I ^{[1
]}

机构：

[1] FURUKAWA ELECT CO LTD,CENT RES LAB,2700 YAWATA,HIRATSUKA 254,JAPAN

来源：

KOBUNSHI RONBUNSHU | 1975年 / 32卷 / 01期

关键词：

D O I：

暂无

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

引用

页码：1 / 6

页数：6

共 20 条

[1] EFFECT OF MOLECULAR-STRUCTURE OF PHENOLIC RESIN ON SOLDER DIP RESISTANCE AND PEEL STRENGTH OF PRINTED CIRCUIT ADHESIVES
NAMIKI, I
JOURNAL OF APPLIED POLYMER SCIENCE, 1976, 20 (03) : 799 - 807
[2] EFFECT OF MOLECULAR-STRUCTURE OF POLYVINYLACETAL ON SOLDER DIP RESISTANCE AND PEEL STRENGTH OF PRINTED CIRCUIT ADHESIVES
NAMIKI, I
HORI, H
KOBUNSHI RONBUNSHU, 1975, 32 (01) : 7 - 12
[3] RELATIONS BETWEEN SOLDER DIP RESISTANCE AND MOISTURE PERMEABILITY OF PRINTED CIRCUIT ADHESIVES
NAMIKI, I
KOBUNSHI RONBUNSHU, 1974, 31 (08) : 489 - 492
[4] RELATIONS BETWEEN SOLDER DIP RESISTANCE AND MOISTURE PERMEABILITY OF PRINTED-CIRCUIT ADHESIVES
NAMIKI, I
JOURNAL OF APPLIED POLYMER SCIENCE, 1976, 20 (07) : 1933 - 1939
[5] Effect of Particle Structure on the Peel Strength and Heat Resistance Properties of Vinyl Acetate/Acrylate Latexes Laminating Adhesives
Zhou, Changlin
Che, Rongsheng
Zhong, Ling
Xu, Wei
Guo, Dongyang
Lei, Jingxin
JOURNAL OF APPLIED POLYMER SCIENCE, 2011, 119 (05) : 2857 - 2865
[6] Effect of phenolic resin structure on the bonding properties of nitrile rubber-based adhesives
Krishnan, PSG
Venkatesan, N
Adhinarayanan, K
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (13) : 1483 - 1495
[7] Effect of phenolic resin structure on the bonding properties of nitrile rubber-based adhesives
Krishnan, P.S.G. (sg-krishnan@imre.a-star.edu.sg), 1600, VSP BV (18):
[8] EFFECT OF MOLECULAR-STRUCTURE AND MORPHOLOGY ON THE STRESS CRACK RESISTANCE OF POLYETHYLENE
FIEDLER, P
BRAUN, D
WEBER, G
MICHLER, GH
ACTA POLYMERICA, 1988, 39 (09) : 481 - 487
[9] Effect of hemicellulose molecular structure on wettability and surface adhesion to urea–formaldehyde resin adhesives
Eko Setio Wibowo
Byung-Dae Park
Wood Science and Technology, 2022, 56 : 1047 - 1070
[10] Effect of chemical structure and cross-link density on the heat resistance of phenolic resin
Wang, Yong
Wang, Shujuan
Bian, Cheng
Zhong, Yuhu
Jing, Xinli
POLYMER DEGRADATION AND STABILITY, 2015, 111 : 239 - 246

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