HALIDE FORMATION AND ETCHING OF CU THIN-FILMS WITH CL2 AND BR2

被引：25
|
作者：
PARK, S
RHODIN, TN
RATHBUN, LC
机构：
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 02期
关键词：
D O I：
10.1116/1.573465
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：168 / 172
页数：5
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