REACTIVE MAGNETRON SPUTTERING OF TIN - ANALYSIS OF THE DEPOSITION PROCESS

被引：18
|
作者：
DANROC, J
AUBERT, A
GILLET, R
机构：
来源：
SURFACE & COATINGS TECHNOLOGY | 1987年 / 33卷 / 1-4期
关键词：
D O I：
10.1016/0257-8972(87)90179-4
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：83 / 90
页数：8
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