DEVELOPING LEAD-FREE SOLDERS - A CHALLENGE AND OPPORTUNITY

被引：63
|
作者：
JIN, SH
机构：
[1] Applied Materials and Metallurgy Research Group, AT and T Bell Laboratories, Murray Hill, New Jersey
来源：
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1993年 / 45卷 / 07期
关键词：
D O I：
10.1007/BF03222373
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：13 / 13
页数：1
相关论文
共 50 条
  • [1] NEW, LEAD-FREE SOLDERS
    MCCORMACK, M
    JIN, S
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) : 635 - 640
  • [2] Database on lead-free solders
    Siewert, TA
    Smith, DR
    Liu, S
    Madeni, JC
    [J]. 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1312 - 1314
  • [3] Rework with lead-free solders
    Wood, Paul
    [J]. Circuits Assembly, 2003, 14 (08): : 18 - 21
  • [4] Overview of lead-free solders
    Sigelko, JD
    Subramanian, KN
    [J]. ADVANCED MATERIALS & PROCESSES, 2000, 157 (03): : 47 - 48
  • [5] Lead-free solders in microelectronics
    Abtew, M
    Selvaduray, G
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6): : 95 - 141
  • [6] The mechanical properties of lead-containing and lead-free solders - meeting the environmental challenge
    Plumbridge, WJ
    Gagg, CR
    [J]. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, 2000, 214 (L3) : 153 - 161
  • [7] Interfacial reaction of lead-free solders with lead-free finished leadframes
    Wong, Y. W.
    Wu, C. M. L.
    Woo, H. C. B.
    Choi, Y. T.
    Li, K. L.
    [J]. 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 412 - 417
  • [8] LEAD-FREE SOLDERS FOR ELECTRONIC ASSEMBLY
    VINCENT, JH
    HUMPSTON, G
    [J]. GEC JOURNAL OF RESEARCH, 1994, 11 (02): : 76 - 89
  • [9] Challenges in attaining lead-free solders
    Baskin, Philip
    [J]. Welding Journal (Miami, Fla), 2007, 86 (03): : 58 - 61
  • [10] Creep phenomena in lead-free solders
    V. I. Igoshev
    J. I. Kleiman
    [J]. Journal of Electronic Materials, 2000, 29 : 244 - 250
12345