Recombination parameters of point defects in dislocation-free silicon single crystals

The recombination parameters of the point defects dynamics (recombination barrier, recombination time, recombination factor) at high and low temperatures are discussed proceeding from the heterogeneous mechanism of grown-in microdefects formation and transformation. The cooling-induced decomposition of the oversaturated solid solution of point defects in silicon follows two mechanisms: vacancy-type and interstitial-type ones. Therefore, vacancies and intrinsic silicon interstitials find drains in the form of background impurity atoms like oxygen and carbon. The formation of intrinsic point defect-impurity pairs is the dominant process at temperatures near the silicon melting point.