PREMELTING OF THIN WIRES

被引:160
|
作者
GULSEREN, O
ERCOLESSI, F
TOSATTI, E
机构
[1] Scuola Internazionale Superiore di Studi Avanzati, SISSA, I-34014 Trieste
关键词
D O I
10.1103/PhysRevB.51.7377
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have investigated the melting behavior of thin lead wires using molecular dynamics. We find thatin analogy with cluster meltingthe melting temperature Tm(R) of a wire with radius R is lower than that of a bulk solid Tmb by Tm(R)=Tmb-c/R. Surface melting effects, with formation of a thin skin of highly diffusive atoms at the wire surface, are observed. The diffusivity is lower over (111)-oriented faces, and higher at (110) and (100) rounded areas. The possible relevance to recent results on nonrupturing thin necks between a scanning tunnel microscope tip and a warm surface is addressed. © 1995 The American Physical Society.
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收藏
页码:7377 / 7380
页数:4
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