The ammonia leaching of alloy produced from waste printed circuit boards smelting process

被引：30
|
作者：
Lim, Yonghun [1 ]
Kwon, Oh-Hyeok [1 ]
Lee, Junseop [2 ]
Yoo, Kyoungkeun [1 ]
机构：
[1] Korea Maritime Univ, Dept Energy & Resources Engn, Busan, South Korea
[2] Technology Res Inst Korea Resources Corp, Seoul, South Korea
来源：
GEOSYSTEM ENGINEERING | 2013年 / 16卷 / 03期
关键词：
ammonia leaching; waste printed circuit boards; recycling; copper recovery;
D O I：
10.1080/12269328.2013.833486
中图分类号：
P [天文学、地球科学];
学科分类号：
07 ;
摘要：
The ammonia leaching tests were carried out to recover valuable metals from alloy obtained from smelting reduction process of mobile phone printed circuit boards. Leaching factors such as kinds of salt, ammonia concentration, and the interaction of metals, which are components of PCB, were investigated to improve the leaching efficiency. In the leaching tests using metal powders such as Zn, Sn, Ni, and Pb to investigate the interaction of metals, zinc was easily dissolved in ammonia solution, whereas Sn and Ni were not detected or the Pb concentration decreased rapidly. The metal concentrations increased with an increase in NH3 concentration from 1 to 5 kmol m(-3). The content of Cu could increase to 98% under the leaching conditions: 2 kmolm 23 NH4Cl and 5 kmol m(-2) NH3 solution with 0.1 kmol m(-2) CuCl2 at 200 rpm and 30 degrees C with 1% pulp density.
引用
收藏
页码：216 / 224
页数：9
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