METAL MICRODISTRIBUTION IN ELECTROLESS COPPER PLATING

被引：0
|
作者：
GOLOVTSHANSKAYA, RG
KRUGLIKOV, SS
MOROZOVA, NA
REKUS, NG
机构：
来源：
SURFACE & COATINGS TECHNOLOGY | 1986年 / 29卷 / 01期
关键词：
D O I：
10.1016/0257-8972(86)90068-X
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：73 / 76
页数：4
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