WORLDWIDE PACKAGING TRENDS

被引：0
|
作者：
OLSSON, M
机构：
来源：
SOLID STATE TECHNOLOGY | 1987年 / 30卷 / 06期
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：49 / 50
页数：2
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