共 50 条
- [1] ROLE OF INTERMEDIATE (CU+) IN THE ELECTRODEPOSITION OF COPPER FROM AN ACID COPPER-SULFATE BATH UNDER THE PULSED CURRENT ELECTROLYSIS [J]. DENKI KAGAKU, 1979, 47 (11): : 654 - 660
- [2] MECHANISM OF THE ELECTRODEPOSITION AND DISSOLUTION OF COPPER IN AN ACID COPPER-SULFATE BATH .3. EFFECT OF CL- IONS [J]. DENKI KAGAKU, 1983, 51 (06): : 456 - 459
- [3] MECHANISM OF ELECTRODEPOSITION AND DISSOLUTION OF COPPER IN AN ACID COPPER-SULFATE BATH .2. MIXED CONTROLLED REACTION MODEL [J]. DENKI KAGAKU, 1982, 50 (12): : 941 - 945
- [4] MECHANISM OF THE ELECTRODEPOSITION AND DISSOLUTION OF COPPER IN AN ACID COPPER-SULFATE BATH .5. ACCELERATION MECHANISM IN THE PRESENCE OF CL- IONS [J]. DENKI KAGAKU, 1983, 51 (06): : 460 - 464
- [5] ADSORPTION BEHAVIOR OF POLYOXYETHYLENEGLYCOLE ON THE COPPER SURFACE IN AN ACID COPPER-SULFATE BATH [J]. DENKI KAGAKU, 1984, 52 (04): : 218 - 223
- [6] SELECTIVE PULSE PLATING FROM AN ACID COPPER-SULFATE BATH [J]. PLATING AND SURFACE FINISHING, 1988, 75 (01): : 67 - 73
- [8] MAGNETIC-FIELD EFFECTS ON THE ELECTRODEPOSITION OF COPPER FROM COPPER-SULFATE IN SULFURIC-ACID [J]. SURFACE & COATINGS TECHNOLOGY, 1988, 34 (04): : 455 - 462