GOLD PLATING .1.

被引：0

作者：

DEUBER, JM ^{[1
]}

机构：

[1] DEGUSSA CORP,S PLAINFIELD,NJ

来源：

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：47 / 50

页数：4

共 50 条

[1] MAXIMIZING GOLD PLATING EFFICIENCY .1. PRECIOUS METALS PLATING
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[2] GOLD-PLATING IN THE EARLY HISTORY .1. LEAFGILDING
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[3] DECORATIVE GOLD PLATING .1. AN HISTORICAL-PERSPECTIVE
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[4] SELECTIVE PLATING .1.
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[5] ADDITIVE-FREE HARD GOLD PLATING FOR ELECTRONICS APPLICATIONS .1. PHYSICAL ASPECTS
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[6] REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .1. INITIAL CHARACTERIZATION
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