MICROWAVE PLASMA ETCHING

被引:257
|
作者
SUZUKI, K [1 ]
OKUDAIRA, S [1 ]
SAKUDO, N [1 ]
KANOMATA, I [1 ]
机构
[1] HITACHI LTD,CENT RES LAB,KOKUBUNJI,TOKYO,JAPAN
关键词
D O I
10.1143/JJAP.16.1979
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:1979 / 1984
页数:6
相关论文
共 50 条
  • [1] MICROWAVE PLASMA-ETCHING
    SUZUKI, K
    NINOMIYA, K
    NISHIMATSU, S
    [J]. VACUUM, 1984, 34 (10-1) : 953 - 957
  • [2] MICROWAVE MULTIPOLAR PLASMA FOR ETCHING AND DEPOSITION
    BURKE, RR
    POMOT, C
    [J]. APPLIED SURFACE SCIENCE, 1989, 36 (1-4) : 267 - 277
  • [3] Etching of GaN by microwave plasma of hydrogen
    Tiwari, Rajanish N.
    Chang, Li
    [J]. SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2010, 25 (03)
  • [4] MICROWAVE MULTIPOLAR PLASMA FOR ETCHING AND DEPOSITION
    BURKE, RR
    POMOT, C
    [J]. SOLID STATE TECHNOLOGY, 1988, 31 (02) : 67 - 71
  • [5] MICROWAVE PLASMA DOWNSTREAM CHEMICAL ETCHING
    ROBINSON, B
    SHIVASHANKAR, SA
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (11) : C471 - C471
  • [6] FUNDAMENTAL CHARACTERISTICS OF MICROWAVE PLASMA-ETCHING
    SUZUKI, K
    OKUDAIRA, S
    NISHIMATSU, S
    USAMI, K
    KANOMATA, I
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C373 - C373
  • [7] Microwave plasma-assisted etching of diamond
    Tran, D. T.
    Grotjohn, T. A.
    Reinhard, D. K.
    Asmussen, J.
    [J]. DIAMOND AND RELATED MATERIALS, 2008, 17 (4-5) : 717 - 721
  • [8] PLATINUM METAL ETCHING IN A MICROWAVE OXYGEN PLASMA
    CHOU, CH
    PHILLIPS, J
    [J]. JOURNAL OF APPLIED PHYSICS, 1990, 68 (05) : 2415 - 2423
  • [9] Dry etching of polydimethylsiloxane using microwave plasma
    Hwang, Sung Jin
    Oh, Dong Joon
    Jung, Phill Gu
    Lee, Sang Min
    Go, Jeung Sang
    Kim, Joon-Ho
    Hwang, Kyu-Youn
    Ko, Jong Soo
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (09)
  • [10] Microwave plasma etching of GaN in nitrogen atmosphere
    Frayssinet, E
    Prystawko, P
    Leszczynski, M
    Domagala, J
    Knap, W
    Robert, JL
    [J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2000, 181 (01): : 151 - 155