ION BACKSCATTERING ANALYSIS OF INTERDIFFUSION IN CU-AU THIN-FILMS

被引：34

作者：

BORDERS, JA ^{[1
]}

机构：

[1] SANDIA LABS,ALBUQUERQUE,NM 87115

来源：

THIN SOLID FILMS | 1973年 / 19卷 / 02期

关键词：

D O I：

10.1016/0040-6090(73)90072-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：359 / 370

页数：12

共 50 条

[1] ION BACKSCATTERING ANALYSIS OF MIXING IN AU-CU AND AU-AL THIN-FILMS
CAMPISANO, SU
FOTI, G
GRASSO, F
RIMINI, E
[J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 1974, : 637 - 640
[2] NONLINEAR DIFFUSION IN CU-AU MULTILAYER THIN-FILMS
MENON, ESK
HUANG, P
KRAITCHMAN, M
HOYT, JJ
CHOW, P
DEFONTAINE, D
[J]. JOURNAL OF APPLIED PHYSICS, 1993, 73 (01) : 142 - 149
[3] FAILURE OF AGED CU-AU THIN-FILMS BY KIRKENDALL POROSITY
FEINSTEIN, LG
BINDELL, JB
[J]. THIN SOLID FILMS, 1979, 62 (01) : 37 - 47
[4] FAILURE OF AGED CU-AU THIN-FILMS BY KIRKENDALL POROSITY
FEINSTEIN, LG
BINDELL, JB
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (02): : 155 - 155
[5] EXAFS INVESTIGATION OF INTERDIFFUSIVE KINETICS IN CU-AU THIN-FILMS
CORNI, F
ANTONINI, GM
[J]. PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1986, 97 (01): : K21 - K24
[6] INTERDIFFUSION, HARDNESS, AND RESISTIVITY OF CR/CU/CO/AU THIN-FILMS
MADAKSON, P
[J]. JOURNAL OF APPLIED PHYSICS, 1991, 70 (03) : 1374 - 1379
[7] ION MIXING IN CU/AU MULTILAYERED THIN-FILMS
HOHMUTH, K
GROTZSCHEL, R
RAUSCHENBACH, B
[J]. EPM 87: ENERGY PULSE AND PARTICLE BEAM MODIFICATION OF MATERIALS, 1988, 8 : 369 - 371
[8] X-RAY STUDY OF INTERDIFFUSION IN BIMETALLIC CU-AU FILMS
TU, KN
BERRY, BS
[J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (08) : 3283 - &
[9] EFFECTS OF C+ IMPLANTATION ON THE INTERDIFFUSION AND RESISTIVITY OF CU/NI/AU THIN-FILMS
MADAKSON, P
KARASINSKI, J
[J]. JOURNAL OF APPLIED PHYSICS, 1990, 67 (10) : 6189 - 6193
[10] INTERDIFFUSION IN THIN-FILMS
TU, KN
[J]. ANNUAL REVIEW OF MATERIALS SCIENCE, 1985, 15 : 147 - 176

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