THE CORROSION OF COPPER AND POROUS GOLD IN FLOWING MIXED GAS ENVIRONMENTS

被引：0
|
作者：
ABBOTT, WH
机构：
来源：
ELECTRICAL CONTACTS - 1989 | 1989年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：141 / 146
页数：6
相关论文
共 50 条
  • [1] THE CORROSION OF COPPER AND POROUS GOLD IN FLOWING MIXED GAS ENVIRONMENTS
    ABBOTT, WH
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (01): : 40 - 45
  • [2] Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments
    K. Hannigan
    M. Reid
    M.N. Collins
    E. Dalton
    C. Xu
    B. Wright
    K. Demirkan
    R.L. Opila
    W.D. Reents
    J.P. Franey
    D.A. Fleming
    J. Punch
    Journal of Electronic Materials, 2012, 41 : 611 - 623
  • [3] Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments
    Hannigan, K.
    Reid, M.
    Collins, M. N.
    Dalton, E.
    Xu, C.
    Wright, B.
    Demirkan, K.
    Opila, R. L.
    Reents, W. D., Jr.
    Franey, J. P.
    Fleming, D. A.
    Punch, J.
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (03) : 611 - 623
  • [4] Study of mixed flowing gas exposure of copper
    Reid, M.
    Punch, J.
    Garfias-Mesias, L. F.
    Shannon, K.
    Belochapkine, S.
    Tanner, D. A.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (04) : C147 - C153
  • [5] CORROSION OF PRECIOUS METAL PLATED COPPER-ALLOYS DUE TO MIXED FLOWING GAS EXPOSURE
    GECKLE, RJ
    MROCZKOWSKI, RS
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (01): : 162 - 169
  • [6] CORROSION OF POROUS GOLD PLATING IN FIELD AND LABORATORY ENVIRONMENTS
    ABBOTT, WH
    PLATING AND SURFACE FINISHING, 1987, 74 (11): : 72 - 75
  • [7] BREAKAWAY CORROSION IN MIXED-GAS ENVIRONMENTS
    NATESAN, K
    BAXTER, DJ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (08) : C336 - C336
  • [8] Flowing mixed gas corrosion test - Gas flow rate effects.
    Imrell, T
    Arnell, S
    Sjovall, R
    ELECTRICAL CONTACTS - 1996: PROCEEDINGS OF THE FORTY-SECOND IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS: JOINT WITH THE 18TH INTERNATIONAL CONFERENCE ON ELECTRICAL CONTACTS, 1996, : 438 - 443
  • [9] Understanding Mixed Flowing Gas Tests: Copper versus Silver
    Osterman, Michael
    Utter, Robert
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (07) : 3846 - 3855
  • [10] Understanding Mixed Flowing Gas Tests: Copper versus Silver
    Michael Osterman
    Robert Utter
    Journal of Electronic Materials, 2021, 50 : 3846 - 3855
12345