EFFECT OF THE TEMPERATURE OF THE MOLD ON THE CURE OF EPOXY-RESIN

被引：0
|
作者：
CHATER, M
VERGNAUD, JM
机构：
来源：
JOURNAL OF POLYMER ENGINEERING | 1988年 / 8卷 / 1-2期
关键词：
D O I：
暂无
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
引用
收藏
页码：1 / 18
页数：18
相关论文
共 50 条
  • [1] EFFECT OF KINETIC AND THERMAL PARAMETERS ON THE PROCESS OF CURE OF EPOXY-RESIN IN A CYLINDRICAL MOLD
    CHATER, M
    VERGNAUD, JM
    [J]. EUROPEAN POLYMER JOURNAL, 1987, 23 (07) : 563 - 569
  • [2] EFFECTS OF CURE TEMPERATURE ON EPOXY-RESIN PROPERTIES
    SINCLAIR, JW
    [J]. JOURNAL OF ADHESION, 1992, 38 (3-4): : 219 - 234
  • [3] EFFECT OF CURE ON STRUCTURE AND MOISTURE INTERACTIONS OF 1009 EPOXY-RESIN
    ILLINGER, JL
    SPROUSE, JF
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1978, 175 (MAR): : 97 - 97
  • [4] EFFECT OF STATE OF CURE ON BOND PERFORMANCE FOR AN EPOXY-RESIN SYSTEM
    BRETT, CL
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 1976, 20 (06) : 1431 - 1440
  • [5] THERMOACOUSTIC MEASUREMENTS DURING CURE OF EPOXY-RESIN AT ROOM-TEMPERATURE
    YOON, HN
    YOON, CN
    KIM, HC
    [J]. JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 1991, 29 (09) : 1081 - 1084
  • [6] ABNORMAL PHENOMENA DURING CURE OF EPOXY-RESIN
    MITSUSHIMA, H
    MIYAGAWA, H
    [J]. KOBUNSHI RONBUNSHU, 1976, 33 (05) : 287 - 292
  • [7] NOVEL PROCESSING AND CURE OF EPOXY-RESIN SYSTEMS
    BREITIGAM, WV
    BAUER, RS
    MAY, CA
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1992, 203 : 392 - POLY
  • [8] KINETIC AND COMPUTER MODELING OF EPOXY-RESIN CURE
    BUIST, GJ
    HAGGER, AJ
    HOWLIN, BJ
    JONES, JR
    PARKER, MJ
    BARTON, JM
    WRIGHT, WW
    [J]. COMPUTERS & CHEMISTRY, 1993, 17 (03): : 257 - 263
  • [9] SEC ANALYSIS OF EPOXY-RESIN CURE KINETICS
    HAGNAUER, GL
    PEARCE, PJ
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1983, 185 (MAR): : 164 - ORPL
  • [10] ISOTHERMAL CURE KINETICS OF AN EPOXY-RESIN PREPREG
    HAGNAUER, GL
    LALIBERTE, BR
    DUNN, DA
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1982, 183 (MAR): : 134 - ORPL
12345