共 50 条
- [3] A MODEL OF THERMAL-STRESS DEVELOPMENT IN MICROELECTRONIC COMPONENTS [J]. ELECTRONIC PACKAGING MATERIALS SCIENCE IV, 1989, 154 : 473 - 478
- [5] THERMAL-STRESS FRACTURE OF REFRACTORY LINING COMPONENTS .1. THERMOELASTIC ANALYSIS [J]. METALLURGICAL TRANSACTIONS B-PROCESS METALLURGY, 1987, 18 (02): : 355 - 363
- [6] INTERFACE CONFIGURATIONS DURING THE DIRECTIONAL GROWTH OF SALOL .2. THERMAL-STRESS CRACKING [J]. ACTA METALLURGICA ET MATERIALIA, 1993, 41 (02): : 425 - 439
- [7] CALCULATION OF THE STATE OF THERMAL-STRESS IN CERAMIC BODIES .2. [J]. SILIKATY, 1986, 30 (01): : 21 - 32