BOND VERIFICATION OF SPACE-SHUTTLE TILES USING TIME-DOMAIN TECHNIQUES

被引：0
|
作者：
BENNIA, A
SU, WS
RIAD, SM
机构：
[1] Bradley Department of Electrical Engineering Virginia Institute Polytechnic and State University, VA
来源：
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 1991年 / 40卷 / 02期
关键词：
D O I：
10.1109/TIM.1990.1032994
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the application of a high resolution time-domain reflectometer (TDR) to detect faulty bonds in space shuttle tile structures. Experimental measurements on bonded and debonded tiles are included to demonstrate the technique. Computer simulations were used to verify the experimental results. A criterion for bond verification is proposed.
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页码：493 / 495
页数：3
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