ENERGY AND ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES

被引:199
|
作者
BETZ, G
WIEN, K
机构
[1] TH DARMSTADT, INST KERNPHYS, D-64289 DARMSTADT, GERMANY
[2] VIENNA TECH UNIV, INST ALLGEMEINE PHYS, A-1040 VIENNA, AUSTRIA
关键词
ANGULAR DISTRIBUTIONS; ENERGY DISTRIBUTIONS; SPUTTERING;
D O I
10.1016/0168-1176(94)04052-4
中图分类号
O64 [物理化学(理论化学)、化学物理学]; O56 [分子物理学、原子物理学];
学科分类号
070203 ; 070304 ; 081704 ; 1406 ;
摘要
A review is presented on energy and angular distributions of atomic, molecular and cluster particles sputtered from solid surfaces under ion bombardment. The review is preferentially focused on experimental results and the corresponding experimental methods; theories about sputtering phenomena are used more as guide-lines for discussion and comparison. The four main areas considered are sputtering of (1) metals, (2) alkali halides, (3) frozen gases, and sputtering by (4) MeV ion impact on insulators. Analysis of the experimental data on energy and angular distributions has revealed a large variety of sputtering modes such as elastic and inelastic collisional sputtering, ion-induced thermal evaporation, ejection of excited atoms, sputtering due to exciton decay, formation of clusters or ejection of grains, sputtering by shock waves and formation of craters associated with an explosive gas flow. The comparison of experimental and theoretical data shows that the theory of linear collision cascades is a good basis for an understanding of the elastic sputtering processes. Also, recent computer simulations of sputtering give valuable insight into collisional processes. The situation is more complex when electronic excitation is the driving interaction of the sputtering process. In this case, depending on the type of target material and the energy loss of the primary ions, a large number of theoretical attempts have been made to describe individual phenomena attributed to electronic sputtering.
引用
收藏
页码:1 / 110
页数:110
相关论文
共 50 条
  • [1] ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES
    BAXTER, JP
    SCHICK, GA
    SINGH, J
    KOBRIN, PH
    WINOGRAD, N
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (03): : 1218 - 1221
  • [2] THE ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES FROM NICKEL
    FAYAZOV, IM
    GARIN, SN
    SIDOROV, AV
    YUNUSOV, AI
    [J]. RADIATION EFFECTS AND DEFECTS IN SOLIDS, 1992, 124 (02): : 197 - 202
  • [3] ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES FROM NITI ALLOY
    NESHEV, I
    HAMISHKEEV, V
    CHERNYSH, VS
    POSTNIKOV, S
    MAMAEV, B
    [J]. VACUUM, 1993, 44 (11-12) : 1131 - 1133
  • [4] ENERGY AND ANGULAR-DISTRIBUTIONS OF SPUTTERED ATOMS AT NORMAL INCIDENCE
    YAMAMURA, Y
    TAKIGUCHI, T
    ISHIDA, M
    [J]. RADIATION EFFECTS AND DEFECTS IN SOLIDS, 1991, 118 (03): : 237 - 261
  • [5] ENERGY-DEPENDENCE OF ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES FROM THE AG(111) SURFACE
    CHANG, CC
    [J]. PHYSICAL REVIEW B, 1993, 48 (17): : 12399 - 12405
  • [6] ENERGY AND ANGULAR-DISTRIBUTIONS OF NEUTRAL BACKSCATTERED PARTICLES
    DEXTER, RN
    [J]. BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1980, 25 (08): : 868 - 868
  • [7] ANGULAR-DISTRIBUTIONS OF SPUTTERED ZIRCONIUM ATOMS
    WHITAKER, TJ
    LI, A
    JONES, PL
    WATTS, RO
    [J]. JOURNAL OF CHEMICAL PHYSICS, 1993, 98 (07): : 5887 - 5898
  • [8] ENERGY-DEPENDENCE OF ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES BY ION-BEAM BOMBARDMENT AT NORMAL INCIDENCE
    MATSUDA, Y
    YAMAMURA, Y
    UEDA, Y
    UCHINO, K
    MURAOKA, K
    MAEDA, M
    AKAZAKI, M
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1986, 25 (01): : 8 - 11
  • [9] ANGULAR-DISTRIBUTIONS OF CHANNELED PARTICLES
    KHOKONOV, MK
    [J]. RADIATION EFFECTS AND DEFECTS IN SOLIDS, 1994, 132 (02): : 91 - 101
  • [10] ENERGY AND ANGULAR-DISTRIBUTIONS OF SPUTTERED PARTICLES - A COMPARISON BETWEEN ANALYTICAL THEORY AND COMPUTER-SIMULATION RESULTS
    VICANEK, M
    URBASSEK, HM
    [J]. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1988, 30 (04): : 507 - 513