HYDROGEN EMBRITTLEMENT OF ELECTROLESS COPPER-DEPOSITS

被引：62

作者：

OKINAKA, Y ^{[1
]}

NAKAHARA, S ^{[1
]}

机构：

[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1976年 / 123卷 / 04期

关键词：

D O I：

10.1149/1.2132858

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：475 / 478

页数：4

共 50 条

[1] HYDROGEN EMBRITTLEMENT OF ELECTROLESS COPPER-DEPOSITS
OKINAKA, Y
NAKAHARA, S
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (08) : C255 - C255
[2] MOLECULAR-HYDROGEN IN ELECTROLESS COPPER-DEPOSITS
GRAEBNER, JE
OKINAKA, Y
[J]. JOURNAL OF APPLIED PHYSICS, 1986, 60 (01) : 36 - 39
[3] MICROSTRUCTURE AND DUCTILITY OF ELECTROLESS COPPER-DEPOSITS
NAKAHARA, S
OKINAKA, Y
[J]. ACTA METALLURGICA, 1983, 31 (05): : 713 - 724
[4] EFFECTS OF INCLUSIONS ON THE DUCTILITY OF ELECTROLESS COPPER-DEPOSITS
OKINAKA, Y
STRASCHIL, HK
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (08) : C353 - C353
[5] THE EFFECT OF INCLUSIONS ON THE DUCTILITY OF ELECTROLESS COPPER-DEPOSITS
OKINAKA, Y
STRASCHIL, HK
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (12) : 2608 - 2615
[6] HYDROGEN EMBRITTLEMENT AND NANO VOID CLASSIFICATION WITHIN ELECTROLESS COPPER DEPOSITS
Bernhard, T.
Steinhaeuser, E.
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Krilles, G.
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[J]. 2020 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC), 2020,
[7] MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF ELECTROLESS COPPER-DEPOSITS
NAKAHARA, S
OKINAKA, Y
[J]. ANNUAL REVIEW OF MATERIALS SCIENCE, 1991, 21 : 93 - 129
[8] CORRELATION OF KINETICS AND PHYSICAL-PROPERTIES OF ELECTROLESS COPPER-DEPOSITS
DONAHUE, FM
LI, AK
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (08) : C324 - C324
[9] EFFECT OF THE TYPE OF SUBSTRATES ON THE DUCTILITY AND MICROSTRUCTURE OF ELECTROLESS COPPER-DEPOSITS
NAKAHARA, S
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OKINAKA, Y
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (02) : 533 - 538
[10] EFFECTS OF STABILIZING ADDITIVES ON MICROSTRUCTURE AND PROPERTIES OF ELECTROLESS COPPER-DEPOSITS
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[J]. METALLURGICAL TRANSACTIONS, 1974, 5 (05): : 1215 - 1223

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