EFFECT OF PACKAGE LID ON THE THERMAL-SHOCK TESTS OF GLASS-TO-METAL SEALS IN MICROELECTRONICS

被引：0
|
作者：
KOKINI, K
机构：
[1] Purdue Univ, West Lafayette, IN, USA, Purdue Univ, West Lafayette, IN, USA
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1986年 / 65卷 / 11期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
8
引用
收藏
页码：1493 / 1497
页数：5
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