FINITE-ELEMENT MODELING OF MULTITURN WINDINGS WITH ATTACHED ELECTRIC-CIRCUITS

被引：6
|
作者：
BRAUER, JR
MACNEAL, BE
机构：
[1] MACNEAL SCHWENDLER CORP,LOS ANGELES,CA 90041
[2] SIGMA XI,RES TRIANGLE PK,NC
来源：
IEEE TRANSACTIONS ON MAGNETICS | 1993年 / 29卷 / 02期
关键词：
7;
D O I：
10.1109/20.250731
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents new and convenient methods of modeling electromagnetic devices with multiturn windings attached to circuits. Techniques are presented for two- and three-dimensional models and for both concentrated and distributed windings. The first application is to a transformer, for which 2D and 3D unsaturated analyses are shown to agree with classical theory. Other applications are to a saturated transformer and to a solenoid with a multiturn winding of large distributed area.
引用
收藏
页码：1693 / 1696
页数：4
相关论文
共 50 条
  • [1] NEW CONSTRAINT TECHNIQUE FOR 3D FINITE-ELEMENT ANALYSIS OF MULTITURN WINDINGS WITH ATTACHED ELECTRIC-CIRCUITS
    BRAUER, JR
    MACNEAL, BE
    MACNEAL, BE
    HIRTENFELDER, F
    IEEE TRANSACTIONS ON MAGNETICS, 1993, 29 (06) : 2446 - 2448
  • [2] FINITE-ELEMENT ANALYSIS IN ELECTROMAGNETIC SYSTEMS ACCOUNTING FOR ELECTRIC-CIRCUITS
    PIRIOU, F
    RAZEK, A
    IEEE TRANSACTIONS ON MAGNETICS, 1993, 29 (02) : 1669 - 1675
  • [3] MODELING ASYNCHRONOUS MACHINES BY ELECTRIC-CIRCUITS
    SEBESTYEN, I
    PERIODICA POLYTECHNICA-ELECTRICAL ENGINEERING, 1976, 20 (02): : 157 - 183
  • [4] MODELING OF ELECTRIC-CIRCUITS COMMUTED BY IDEAL KEYS
    RUDENKO, AV
    AVTOMATIKA, 1985, (06): : 32 - 35
  • [5] Finite-Element Modeling for Analysis of Radial Deformations Within Transformer Windings
    Zhang, Z. W.
    Tang, W. H.
    Ji, T. Y.
    Wu, Q. H.
    IEEE TRANSACTIONS ON POWER DELIVERY, 2014, 29 (05) : 2297 - 2305
  • [6] A Finite-Element Method Framework for Modeling Rotating Machines With Superconducting Windings
    Brambilla, Roberto
    Grilli, Francesco
    Martini, Luciano
    Bocchi, Marco
    Angeli, Giuliano
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2018, 28 (05)
  • [7] The finite-element method for modeling circuits and interconnects for electronic packaging
    Polycarpou, AC
    Tirkas, PA
    Balanis, CA
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (10) : 1868 - 1874
  • [8] FINITE-ELEMENT MODELING
    WAAS, G
    GEOPHYSICS, 1973, 38 (01) : 193 - &
  • [9] FINITE-ELEMENT MODELING
    CHEN, KH
    GEOPHYSICS, 1985, 50 (07) : 1193 - 1194
  • [10] MODELING OF ELECTROMECHANICAL RELAYS TAKING INTO ACCOUNT MOVEMENT AND ELECTRIC-CIRCUITS
    HENROTTE, F
    NICOLET, A
    HEDIA, H
    GENON, A
    LEGROS, W
    IEEE TRANSACTIONS ON MAGNETICS, 1994, 30 (05) : 3236 - 3239
12345