RELATION BETWEEN THE PHYSICAL-PROPERTIES OF CHEMICALLY DEPOSITED COPPER AND ELECTROLYTE-COMPOSITION

In this work an investigation has been made of a copper coating chemically deposited from tartrate solutions onto a polished nickel substrate. It is found that the introduction of cadmium ions into the copper plating chemical solutions decreases the coating strength to 360 MPa and ductility to 2. 7%, while the presence of cobalt ions in the electrolyte raises the copper ductility to 4%, but reduces the strength to 287 MPa. Changes in the deposition time leads to producing coatings of different thickness. As it increases from 3 to 30 mu there is also an increase in the ductility of the chemically deposited copper from 0. 8 to 3. 8%.