ELECTRONIC PACKAGING AND INTERCONNECTION TECHNOLOGY - STATE-OF-THE-ART AND FUTURE-DEVELOPMENTS

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NEUGEBAUER, CA

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MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES | 1989年

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TM [电工技术]; TN [电子技术、通信技术];

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0808 ; 0809 ;

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页码：1 / 2

页数：2

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