METAL-MATRIX COMPOSITES FOR ELECTRONIC PACKAGING

被引：55

作者：

ZWEBEN, C

机构：

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1992年 / 44卷 / 07期

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A materials revolution is underway, and there are profound implications for electronic packaging materials. Composites, especially metal-matrix composites, are playing a key role, because of their unique and tailorable combinations of properties; light weight; and low-cost, net-shape fabrication potential.

引用

页码：15 / 23

页数：9

共 50 条

[1] LOW EXPANSION METAL-MATRIX COMPOSITES FOR ELECTRONIC PACKAGING
GEIGER, AL
JACKSON, M
[J]. MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 93 - 102
[2] COEFFICIENTS OF THERMAL-EXPANSION OF METAL-MATRIX COMPOSITES FOR ELECTRONIC PACKAGING
SHEN, YL
NEEDLEMAN, A
SURESH, S
[J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1994, 25 (04): : 839 - 850
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不详
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