FACTORS INFLUENCING THE QUALITY OF SOLDER POWDER USED IN SOLDER PASTES FOR THICK-FILM CIRCUITS, PRINTED CIRCUITBOARDS AND THE ELECTRONICS INDUSTRY IN GENERAL

被引：1

|

作者：

ANJARD, RP

机构：

来源：

POWDER TECHNOLOGY | 1983年 / 36卷 / 02期

关键词：

D O I：

10.1016/0032-5910(83)85003-7

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

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页码：189 / 202

页数：14

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[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815
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[3] FACTORS AFFECTING SOLDER WETTING AND RESISTANCE DRIFT IN THICK FILM CIRCUITS
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[J]. PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1969, : 329 - &
[4] Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration
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[J]. FLEXIBLE AND PRINTED ELECTRONICS, 2022, 7 (03):
[5] THICK-FILM RUTHENIUM RESISTOR PASTES. NEW COMPOSITIONS FOR SCREEN-PRINTED CIRCUITS.
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[J]. Platinum Metals Review, 1973, 17 (01) : 14 - 20