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- [2] DEPOSITION OF TIN-BISMUTH ALLOY BY CONTACT DISPLACEMENT PROTECTION OF METALS, 1977, 13 (03): : 298 - 299
- [3] ANISOTROPY OF SUPERPLASTIC PROPERTIES OF EUTECTIC TIN-BISMUTH ALLOY ZEITSCHRIFT FUR METALLKUNDE, 1979, 70 (09): : 573 - 576
- [4] Tin, Bismuth, and Tin-Bismuth Alloy Electrodeposition from Chlorometalate Salts in Deep Eutectic Solvents CHEMISTRYOPEN, 2017, 6 (03): : 393 - 401
- [5] TEM study of Bi segregation in the interconnect of eutectic tin-bismuth solder and copper ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 765 - 767