The Development and Commercialization of Lead-Free Soldering

被引：0
|
作者：
Katsuaki Suganuma
机构：
来源：
MRS Bulletin | 2001年 / 26卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：880 / 884
页数：4
相关论文
共 50 条
  • [1] The development and commercialization of lead-free soldering
    Suganuma, K
    [J]. MRS BULLETIN, 2001, 26 (11) : 880 - 884
  • [2] lead-free soldering
    Steffner, KJ
    [J]. KUNSTSTOFFE-PLAST EUROPE, 2005, 95 (09): : 195 - 198
  • [3] Development of lead-free wave soldering process
    Arra, M
    Shangguan, D
    Yi, S
    Thalhammer, R
    Fockenberger, H
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (04): : 289 - 299
  • [4] LEAD-FREE SOLDERING TECHNOLOGY
    Oancea, C. D.
    Oancea, C.
    [J]. JOURNAL OF ENVIRONMENTAL PROTECTION AND ECOLOGY, 2011, 12 (01): : 98 - 105
  • [5] Lead-free soldering by hand
    ERSA GmbH, Wertheim, Germany
    不详
    不详
    [J]. Assembly, 2007, 5 (50-55):
  • [6] Interfaces in lead-free soldering
    Hwang, CW
    Kim, KS
    Suganuma, K
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (11) : 1249 - 1256
  • [7] Roadmap of lead-free soldering
    Szendiuch, Ivan
    [J]. 2007 30TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2007, : 527 - 534
  • [8] Lead-free wave soldering development for PCB assembly
    Sunappan, V
    Collier, P
    [J]. 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1829 - 1838
  • [9] Interfaces in lead-free soldering
    Chi-Won Hwang
    Keun-Soo Kim
    Katsuaki Suganuma
    [J]. Journal of Electronic Materials, 2003, 32 : 1249 - 1256
  • [10] Development and validation of lead-free wave soldering process
    Forstén, A
    Steen, H
    Wilding, I
    Friedrich, J
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2000, 12 (03) : 29 - 34
12345