A new semi-analytical prediction model for temperature field of ultrasonic vibration grinding of single abrasive particles

Single abrasive particles ultrasonic vibration grinding serves as the foundation for investigating the ultrasonic vibration grinding process. This paper proposes an innovative semi-analytical model, known as the ultrasonic vibration grinding heat transfer analysis (UVGHTA) model, which accurately predicts the temperature field in single abrasive particles ultrasonic vibration grinding with complex motion-induced heat sources. Firstly, a Gaussian-shaped heat source model is established for the grinding zone. Then, the alternating direction implicit (ADI) scheme of the finite difference method is employed to solve the heat conduction partial differential equations with ultrasonic heat source load boundary conditions. During the numerical iteration process, a synchronized additional method for heat sources is introduced to incorporate the temperature rise caused by the continuously moving heat source into the calculations, resulting in a complete semi-analytical predictive model that accurately simulates the dynamic temperature field in ultrasonic vibration grinding. Finally, the temperature field calculation results of the proposed model are compared with the finite element software calculation results and the experimentally measured temperature values for verification. This study addresses the challenge of predicting the temperature field in single abrasive particles ultrasonic grinding and provides a new approach to predicting the work surface temperature field in the heat transfer process involving multi-dimensional motion-induced time-varying heat sources.