Thermographic Microstructure Monitoring in Electron Beam Additive Manufacturing

被引:0
|
作者
J. Raplee
A. Plotkowski
M. M. Kirka
R. Dinwiddie
A. Okello
R. R. Dehoff
S. S. Babu
机构
[1] Aerospace,Department of Mechanical
[2] and Biomedical Engineering,Materials Science & Technology Division
[3] University of Tennessee,undefined
[4] Manufacturing Demonstration Facility,undefined
[5] Oak Ridge National Laboratory,undefined
[6] Oak Ridge National Laboratory,undefined
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
To reduce the uncertainty of build performance in metal additive manufacturing, robust process monitoring systems that can detect imperfections and improve repeatability are desired. One of the most promising methods for in situ monitoring is thermographic imaging. However, there is a challenge in using this technology due to the difference in surface emittance between the metal powder and solidified part being observed that affects the accuracy of the temperature data collected. The purpose of the present study was to develop a method for properly calibrating temperature profiles from thermographic data to account for this emittance change and to determine important characteristics of the build through additional processing. The thermographic data was analyzed to identify the transition of material from metal powder to a solid as-printed part. A corrected temperature profile was then assembled for each point using calibrations for these surface conditions. Using this data, the thermal gradient and solid-liquid interface velocity were approximated and correlated to experimentally observed microstructural variation within the part. This work shows that by using a method of process monitoring, repeatability of a build could be monitored specifically in relation to microstructure control.
引用
收藏
相关论文
共 50 条
  • [1] Thermographic Microstructure Monitoring in Electron Beam Additive Manufacturing
    Raplee, J.
    Plotkowski, A.
    Kirka, M. M.
    Dinwiddie, R.
    Okello, A.
    Dehoff, R. R.
    Babu, S. S.
    [J]. SCIENTIFIC REPORTS, 2017, 7
  • [2] Thermographic In-Situ Process Monitoring of the Electron Beam Melting Technology used in Additive Manufacturing
    Dinwiddie, Ralph B.
    Dehoff, Ryan R.
    Lloyd, Peter D.
    Lowe, Larry E.
    Ulrich, Joe B.
    [J]. THERMOSENSE: THERMAL INFRARED APPLICATIONS XXXV, 2013, 8705
  • [3] Thermographic Process Monitoring in Powderbed Based Additive Manufacturing
    Krauss, Harald
    Zeugner, Thomas
    Zaeh, Michael F.
    [J]. 41ST ANNUAL REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOL 34, 2015, 1650 : 177 - 183
  • [4] Phase-field simulation of microstructure evolution in electron beam additive manufacturing
    Shuo Chu
    Chunwen Guo
    Tongxin Zhang
    Yueting Wang
    Junjie Li
    Zhijun Wang
    Jincheng Wang
    Ya Qian
    Haiyan Zhao
    [J]. The European Physical Journal E, 2020, 43
  • [5] Phase-field simulation of microstructure evolution in electron beam additive manufacturing
    Chu, Shuo
    Guo, Chunwen
    Zhang, Tongxin
    Wang, Yueting
    Li, Junjie
    Wang, Zhijun
    Wang, Jincheng
    Qian, Ya
    Zhao, Haiyan
    [J]. EUROPEAN PHYSICAL JOURNAL E, 2020, 43 (06):
  • [6] The Investigation of microstructure evolution in electron beam additive manufacturing by phase field method
    Ai, Yuewei
    Huang, Yi
    Yu, Long
    Liu, Xiaoying
    [J]. JOURNAL OF LASER APPLICATIONS, 2021, 33 (04)
  • [7] Phase-Field Modeling of Microstructure Evolution in Electron Beam Additive Manufacturing
    Xibing Gong
    Kevin Chou
    [J]. JOM, 2015, 67 : 1176 - 1182
  • [8] Phase-Field Modeling of Microstructure Evolution in Electron Beam Additive Manufacturing
    Gong, Xibing
    Chou, Kevin
    [J]. JOM, 2015, 67 (05) : 1176 - 1182
  • [9] Progress in electron beam additive manufacturing
    Markl, Matthias
    Colosimo, Bianca M.
    Koerner, Carolin
    [J]. PROGRESS IN ADDITIVE MANUFACTURING, 2024, 9 (05) : 1415 - 1415
  • [10] Microstructure and Elevated Temperature Flexure Testing of Tungsten Produced by Electron Beam Additive Manufacturing
    Zhang, Haozhi
    Carriere, Paul R.
    Amoako, Emmanuel D.
    Rock, Chris D.
    Thielk, Seiji U.
    Fletcher, Colin G.
    Horn, Timothy J.
    [J]. JOM, 2023, 75 (10) : 4094 - 4107