Preface to the HTC 2012 special issue

被引：0
|
作者：
Wayne D. Kaplan
机构：
[1] Technion – Israel Institute of Technology,Department of Materials Science and Engineering
来源：
Journal of Materials Science | 2012年 / 47卷
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D O I：
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摘要：
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页码：8245 / 8246
页数：1
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