Numerical simulation of non-destructive testing of stainless steel composites plate by infrared thermography

被引：2
|
作者：
Li G.-H. [1 ]
Hu Y. [1 ]
Fang J.-Y. [1 ]
Gu X.-Y. [1 ]
Gao J.-C. [1 ]
Wu M. [1 ]
机构：
[1] School of Mechanical, Electronic and Information Engineering, China University of Mining and Technology (Beijing)
来源：
Journal of Shanghai Jiaotong University (Science) | 2011年 / 16卷 / 03期
关键词：
Infrared thermography; Non-destructive testing (NDT); Numerical simulation; Stainless steel composites plate (SSCP);
D O I：
10.1007/s12204-011-1155-y
中图分类号：
学科分类号：
摘要：
The non-destructive testing (NDT) of debonding in stainless steel composites plate (SSCP) is performed by infrared thermography, finite element analysis (FEA) software ANSYS is taken as the simulative tool, and 2D simulative model has been set up to investigate effect of the thickness of coating and/or substrate on the detectibility of debonging in SSCPs. Two parameters, namely the maximum defect temperature difference and defect appearing index, are defined to evaluate the detectivity of defects, and their computational methods and formulas are given respectively. The preliminary changing tendency of the maximum defect temperature difference and defect appearing index with the thickness of coating and/or substrate is found by numerical simulation. © Shanghai Jiaotong University and Springer-Verlag Berlin Heidelberg 2011.
引用
收藏
页码：333 / 336
页数：3
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