Electrochemical etching of p–n-GaN/AlGaN photoelectrodes

被引:0
|
作者
A. S. Usikov
H. Helava
A. Nikiforov
M. V. Puzyk
B. P. Papchenko
Yu. V. Kovaleva
Yu. N. Makarov
机构
[1] National Research University of Information Technologies,
[2] Mechanics,undefined
[3] and Optics (ITMO University),undefined
[4] Nitride Crystals Inc.,undefined
[5] Herzen State Pedagogical University of Russia,undefined
[6] Boston University,undefined
[7] Photonics Center,undefined
[8] Nitride Crystals Group of Companies,undefined
来源
Technical Physics Letters | 2016年 / 42卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
Specific features of etching of GaN/AlGaN p–n structures in a KOH-based electrolyte have been studied. It was found that the corrosion process first passes across p layers through vertical channels associated with threading structural defects. Then, the corrosion process occurs in the lateral direction along n layers of the structure, with local hollows and voids thereby formed. The lateral etching is due to the presence of positive piezoelectric charges at boundaries of n-AlGaN and n-GaN layers and positively charged ionized donors in the space-charge region of the p–n junction.
引用
收藏
页码:482 / 485
页数:3
相关论文
共 50 条
  • [1] Electrochemical etching of p-n-GaN/AlGaN photoelectrodes
    Usikov, A. S.
    Helava, H.
    Nikiforov, A.
    Puzyk, M. V.
    Papchenko, B. P.
    Kovaleva, Yu V.
    Makarov, Yu N.
    TECHNICAL PHYSICS LETTERS, 2016, 42 (05) : 482 - 485
  • [2] Photoenhanced electrochemical etching of n-GaN forced by negative bias
    Seo, JW
    Oh, CS
    Yang, JW
    Yoon, CJ
    Lim, KY
    Lee, HJ
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2001, 40 (10B): : L1086 - L1088
  • [3] Photoenhanced electrochemical etching of n-GaN forced by negative bias
    Seo, J.W.
    Oh, C.S.
    Yang, J.W.
    Yoon, C.J.
    Lim, K.Y.
    Lee, H.J.
    Japanese Journal of Applied Physics, Part 2: Letters, 2001, 40 (10 B):
  • [4] Allowable substrate bias for the etching of n-GaN in photo-enhanced electrochemical etching
    Seo, JW
    Oh, CS
    Yang, JW
    Yang, GM
    Lim, KY
    Yoon, CJ
    Lee, HJ
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2001, 188 (01): : 403 - 406
  • [5] Analysis of the n-GaN electrochemical etching process and its mechanism in oxalic acid
    Shushanian, Artem
    Iida, Daisuke
    Zhuang, Zhe
    Han, Yu
    Ohkawa, Kazuhiro
    RSC ADVANCES, 2022, 12 (08) : 4648 - 4655
  • [6] On the effect of N-GaN/P-GaN/N-GaN/P-GaN/N-GaN built-in junctions in the n-GaN layer for InGaN/GaN light-emitting diodes
    Kyaw, Zabu
    Zhang, Zi-Hui
    Liu, Wei
    Tan, Swee Tiam
    Ju, Zhen Gang
    Zhang, Xue Liang
    Ji, Yun
    Hasanov, Namig
    Zhu, Binbin
    Lu, Shunpeng
    Zhang, Yiping
    Sun, Xiao Wei
    Demir, Hilmi Volkan
    OPTICS EXPRESS, 2014, 22 (01): : 809 - 816
  • [7] Characteristics of n-GaN after ICP etching
    Han, YJ
    Xue, S
    Guo, WP
    Hao, ZB
    Sun, CZ
    Luo, Y
    MATERIALS, DEVICES, AND SYSTEMS FOR DISPLAY AND LIGHTING, 2002, 4918 : 193 - 196
  • [8] Etching damage and its recovery in n-GaN by reactive ion etching
    Chen, ZZ
    Qin, ZX
    Tong, YZ
    Ding, XM
    Hu, XD
    Yu, TJ
    Yang, ZJ
    Zhang, GY
    PHYSICA B-CONDENSED MATTER, 2003, 334 (1-2) : 188 - 192
  • [9] Etching of n-GaN - Important step in device processing
    Skriniarova, Jaroslava
    Kovac, Jaroslav
    VACUUM, 2009, 84 (01) : 221 - 223
  • [10] Electrical properties of n-Gan/p-SiC and n-AlGaN/p-SiC heterojunction diodes
    Luo, B
    Kim, J
    Mehandru, R
    Ren, F
    Lee, KP
    Pearton, SJ
    Polyakov, AY
    Smirnov, NB
    Govorkov, AV
    Kozhukhova, EA
    Tolmachevsky, B
    Osinsky, AV
    Norris, PE
    GAN AND RELATED ALLOYS-2001, 2002, 693 : 659 - 664