Nanoscratch Behavior of Dendrimer-Mediated Ti Thin Films

被引：0
|
作者：
X. Li
F. Huang
M. Curry
S.C. Street
M.L. Weaver
机构：
[1] The University of Alabama,Center for Materials for Information Technology
[2] The University of Alabama,Department of Chemistry
[3] The University of Alabama,Department of Metallurgical and Materials Engineering
来源：
Tribology Letters | 2005年 / 19卷
关键词：
nanoscratch; failure mode; Ti film; dendrimer;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Ramped load nanoscratch behaviors of titanium thin films with and without dendrimer mediation were extensively studied. By combining in situ investigation of scratch surface profiles and coefficients of friction curves, with ex situ microscopic (OM, AFM) and spectroscopic (AES) examinations of scratch tracks, different scratch failure modes were identified. An adhesive failure was found in the dendrimer-mediated films, whereas a cohesive failure was in the dendrimer-free samples.
引用
收藏
页码：273 / 280
页数：7
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