Forming analysis of T2 copper foil processed by submerged water jet cavitation

The demand for micro-components continues to increase, and there is a constant trend towards miniaturization and complexity. The traditional forming process micromachining technology has disadvantages such as high cost, complex manufacturing process, and long cycle, which cannot meet the needs of the industrial development. A new micro-forming process of metal foil arrays based on submerged cavitation water jets is proposed in this paper, and the shapes of the mold grooves are selected as triangular, quadrilateral, pentagonal, and hexagonal. The micro-jet and shock wave generated by the collapse of the cavitation in the submerged cavitation jet is used as the force-loading method of the foil to complete the flexible array micro-forming of the metal foil in this process. The results show that: the flow field at different incident pressures has low pressure and low pressure action time, fully satisfying the conditions required for cavitation to occur; the flooded cavitation water jet is concentrated in the downstream collapse area as a ring-shaped area; the more the number of single hole sides of the mold, the lower the deformation resistance in each area of the T2 Cu foil, and the clearer the T2 Cu foil forming profile. The submerged cavitation water jet array micro-forming studied in this paper is a low-cost, green, high-efficiency, and highly applicable forming process, which is a beneficial exploration and attempt at a new type of foil array micro-forming, which has high research value and good application prospects.