Fabrication of Microstripline Wiring for Large Format Transition Edge Sensor Arrays

被引：0
|
作者：
J. A. Chervenak
J. M. Adams
C. N. Bailey
S. Bandler
R. P. Brekosky
M. E. Eckart
A. E. Ewin
F. M. Finkbeiner
R. L. Kelley
C. A. Kilbourne
F. S. Porter
J. E. Sadlier
S. J. Smith
机构：
[1] NASA Goddard Space Flight Center,
来源：
Journal of Low Temperature Physics | 2012年 / 167卷
关键词：
Transition edge sensor; Fabrication; Large format array;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
We have developed a process to integrate microstripline wiring with transition edge sensors (TES). The process includes additional layers for metal-etch stop and dielectric adhesion to enable recovery of parameters achieved in non-microstrip pixel designs. We report on device parameters in close-packed TES arrays achieved with the microstrip process including Rn, G, and Tc uniformity. Further, we investigate limits of this method of producing high-density, microstrip wiring including critical current to determine the ultimate scalability of TES arrays with two layers of wiring.
引用
收藏
页码：547 / 553
页数：6
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