Atomic Understanding of the Plastic Deformation Mechanism of 4H-SiC Under Different Grain Depth-of-cut During Nano-Grinding

被引：0
|
作者：
Haoxiang Wang
Shang Gao
Xiaoguang Guo
Yulong Ding
Renke Kang
机构：
[1] Dalian University of Technology,State Key Laboratory of High
[2] State Key Laboratory of High Performance Tools,Performance Precision Manufacturing
[3] Zhengzhou Research Institute for Abrasives & Grinding Co.,undefined
[4] Ltd.,undefined
来源：
Journal of Electronic Materials | 2023年 / 52卷
关键词：
4H-SiC; nano-grinding; grain depth-of-cut; plastic deformation mechanism;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：4865 / 4877
页数：12
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