3D printing of thermosets with diverse rheological and functional applicabilities

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作者
Yuxuan Sun
Liu Wang
Yangyang Ni
Huajian Zhang
Xiang Cui
Jiahao Li
Yinbo Zhu
Ji Liu
Shiwu Zhang
Yong Chen
Mujun Li
机构
[1] University of Science and Technology of China,Department of Precision Machinery and Precision Instrumentation
[2] University of Science and Technology of China,CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics
[3] University of Science and Technology of China,School of Computer Science and Technology
[4] Southern University of Science and Technology of China,Department of Mechanical and Energy Engineering
[5] Viterbi School of Engineering,Epstein Department of Industrial and Systems Engineering
[6] University of Southern California,undefined
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摘要
Thermosets such as silicone are ubiquitous. However, existing manufacturing of thermosets involves either a prolonged manufacturing cycle (e.g., reaction injection molding), low geometric complexity (e.g., casting), or limited processable materials (e.g., frontal polymerization). Here, we report an in situ dual heating (ISDH) strategy for the rapid 3D printing of thermosets with complex structures and diverse rheological properties by incorporating direct ink writing (DIW) technique and a heating-accelerated in situ gelation mechanism. Enabled by an integrated Joule heater at the printhead, extruded thermosetting inks can quickly cure in situ, allowing for DIW of various thermosets with viscosities spanning five orders of magnitude, printed height over 100 mm, and high resolution of 50 μm. We further demonstrate DIW of a set of heterogenous thermosets using multiple functional materials and present a hybrid printing of a multilayer soft electronic circuit. Our ISDH strategy paves the way for fast manufacturing of thermosets for various emerging fields.
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